Microelectronics Design Engineers' areas of responsibility can include:
- Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design
- Register Transfer Level (RTL) design including Verilog and VHDL
- Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis
- Printed Circuit Board (PCB) design
- Microelectronics package engineering
- Custom package design
- Multi-Chip Module (MCM) design
- Assembly specifications
- Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis
Microelectronics Assembly Engineers' areas of responsibility can include:
- Packaging and/or assembling integrated circuit devices
- Assembly of custom electronic packaging solutions
- Printed Circuit Board (PCB) assembly
- Multi-Chip Module (MCM) assembly
- Process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics
Microelectronics Test and Reliability Engineers' areas of responsibility can include:
- High-pin-count Integrated Circuit (IC) design and operation validation
- Parametric testing
- Accelerated testing / qualification / screening
Other responsibilities of a Microelectronics Engineer at Secur may include:
- Create and maintain documentation on technical information
- Operate specialized scientific and technical equipment
- Attend conferences and communicate with people in a particular technical field to keep abreast of new technologies and information
- Conduct research including studies, experiments, and investigations
- Research emerging technologies for application(s) within the company
- Serve as a subject matter expert to support research and development efforts
The ideal candidate is someone with excellent problem-solving, communication, and interpersonal skills who is:
- Motivated
- Creative
- Able to work effectively across several different functional areas in a collaborative environment
- Well-organized and able to handle multiple assignments
- Customer service and requirements focused
- Detail oriented
Knowledge and experience in one or more of the following is desired:
- Concepts, theories, and methods related to the composition, structure, and properties of materials, and the identification/processing of optimal materials for various uses
- Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems.
- Solving technical problems
- Translate conceptual designs into technical specifications
- Use modeling/simulation to evaluate designs
- Designing digital circuits (e.g., FPGAs, ASICs)
- Microelectronics design engineering including analog or digital logic design is desired. Experience using Electronic Design Automation (EDA) tools is required
- Packaging and/or assembling integrated circuit devices
- Applying engineering principles to perform printed circuit board layout
- The scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results)
- Semiconductor or integrated circuit quality assurance and materials science/fabrication experience is preferred
- Testing integrated circuit devices
- Evaluate information in technical documents to understand its importance and significance
- Work with customers to clarify their needs and to determine how their needs can be met
- Semiconductor or integrated circuit quality assurance
- Operate specialized scientific and technical equipmentSpecialized skills and experience in one or more of the following are desired:
- concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems
- ASIC, FPGA, PCB design, assembly, testing, and quality assurance
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